eldrotec Temperature Forcing Systems

eldrotec – innovating and leading in Temperature Forcing Systems (Temperature Management Systems)

eldrotec Develops, Produces and Supplies advanced Temperature Forcing Systems for more than 20 years.

eldrotec works with customers from Semiconductors, Electronics, Optics, Telecommunication, Sensors, automotive, Aerospace/Defense and other companies that need to force and test temperature on their DUT’s (Device Under Test) in Development and Production process,

for Testing, Validation, Characterization and Failure Analysis, of IC, Wafer, Silicon Chip, Electronics Devices, Optical Component and more.

The Temperature Forcing Systems are designed to assist you in the process of temperature testing, characterization and validation in the development and manufacture of Devices such as Semiconductor and Electronic and other devices.

The Temperature Forcing Systems manage precise temperature at a rapid rate of change.

eldrotec has

Temperature Forcing Systems – Direct Contact Thermal head cooling

and Temperature Forcing Systems – Airstream

Temperature ranges: from -75°C to 225°C (±0.1).

DUT’s electrical power: from 1 Watt up to 600 Watt (optional up to 1500 Watt)

The systems are adapted for use in all relevant industries: Semiconductor, Aerospace & Defense, Automotive, Energy, Bio-Medical , Telecom and other industries.

eldrotec’s Temperature Forcing Systems support the DUT’s Packages:

IC, CPU, GPU, DPU, BGA, FCBGA, LGA, QFN, QFP, CSP, WLCSP, Bare Die, and other Device Under Test..

eldrotec providing warranty and service in personal attention and attentive to the needs and to the desires of the customers and strive to provide the most suitable systems and solutions.

You’re welcome to review our Temperature Forcing Systems and choose the right system for you.

feel free to contact us and ask any questions, we will offer you the best system for you.

Temperature Forcing Systems - Direct Contact

Eldrotec has an advanced Temperature Forcing systems – Direct Contact, Thermal Head Cooling
Benchtop Systems for IC Thermal Characterization, Silicon Chip, Electronics Devices & Optical Component. eldrotec’s Temperature forcing systems stimulates the DUT’s to the desired temperature (cooling / heating) by direct contact between a thermal head’s Pedestal and a socketed or soldered down DUT.

The thermal head’s Pedestal adjusted according to your devices / packages dimensions. eldrotec’s Thermal forcing systems provides a highly responsive, thermally conductive path to quickly induce temperatures on the DUT.

eldrotec’s Temperature forcing Systems can be used to test multi-site DUTs using a thermal plate. It can be integrated into probe stations, handlers, testers, and ATEs.
eldrotec’s Temperature forcing Systems are stand-alone, plug and play systems which requires only electrical wall outlet and clean dry air or nitrogen for condensation free operation during cold testing.

eldrotec provides highly reliable systems uses a patented thermal probe to mate directly to your IC or other device under test. Using proprietary, robust refrigeration technology can perform thermal cycling without the worry of cooling degradation.

System / DUT’s	Power range	Temperature range	Dimensions (mm)	Pressing Control on DUT (±1 kg)	Remote Interface Ports
Fix	0-100W	-55°C to +155°C [-40°C @ 25W]	2X2 to 40X40	0 – 45	TCP/IP, 485, USB
Mid-2	0-150W	-60°C to +150°C [-40°C @ 100W]	2X2 to 50X50	0 – 75
Mid-3	0-250W	-60°C to +150°C [-40°C @ 250W]	2X2 to 50X50	0 – 75
Mug-SH-7	0-450W	-75°C to +150°C [-40°C @ 400W]	25X25 to 70X70 Optional up to 100X100	0 – 180 Optional up to 300
Mug-SH-11	0-850W	-75°C to +150°C [-40°C @ 800W]
Mug-SH-15	0-1500W	-75°C to +150°C [-40°C @ 1000W]

Direct contact systems

Temperature Forcing Systems - Airstream

What is for ?

Cold & Hot Airstream systems – Which provide cold & hot air Flow / Jet direct to tested device or heat dissipation by Cold Plates, Heat Exchangers & Heat Sink. Temperatures ranging from -75 C° to + 225 C°, Air flow up to 70 SCFM , up to 10 bar.

TX Series – Mobile Temperature Environments.

Mobile temperature environments are used in many industries including: Semiconductor, Aerospace & Defense, Automotive, Energy, Bio-Medical , Telecom and others.

Electronic device and material testing, characterization and verification for: ICs, MEMS, Transceivers, Circuits and other components testing.

TX Series	TX-1000	TX-2500	TX-4000	TX-4500
Temperature range	-30°C to 150°C	-52°C to 225°C	-60°C to 225°C	-75°C to 225°C
Air Flow Airstream	4 to 25 scfm	4 to 40 scfm	4 to 70 scfm	4 to 40 scfm
Temperature display & Resolution	±1°C
Remote interface	TCP/IP, RS232, RS485, Python and all Labs Interface Ports
Electrical	200-240VAC, 50/60Hz, 16A	3PH 380 / 3PH 200-223, 50/60Hz, 16A	3PH 380 3PH 200-223 50/60Hz, 16A	3PH 380 3PH 200-223 50/60Hz, 16A
Compressed Air Pressure Facility Requirements	CDA at 90 psi Minimum Dewpoint: -70°C @ 90 psi
Air Flow Facility Requirements	10-30 scfm (4.72 to 14.2 l/s)	10-50 scfm (4.72 to 23.6 l/s)	10-80 scfm (7.1 to 37.8 l/s)	10-80 scfm (7.1 to 37.8 l/s)