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EXCEL-12

High Power Electronic and Semiconductor Temperature Testing and Verification System – Direct Contact

Advanced system for testing and verifying the temperature of high power electronic and semiconductor components up to 1200 W, in an extreme temperature range of -20°C to 150°C and precise temperature control.

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The EXCEL-12 system is a powerful and accurate temperature control system designed to test high-power electronic and semiconductor components over a wide temperature range. It features a special thermal head (a fast-conducting thermal path) that allows for precise temperature control of the device under test (DUT). The system provides reliable performance for high-power testing and verification.

Key Features

Performance Features

  • • Temperature range: -20°C to 150°C
  • • Temperature stability: ±0.1°C
  • • Power range: 0-1200 W

Model variants

  • • EXCEL-12: up to 1200 W [0°C at 12000W]

Advanced design

  • • Fully automated DUT pressure force: ~3-75 Kg Force on DUT/Socket ±1 Kg
  • • Patented thermal probe
  • • Robust refrigeration technology without thermoelectric modules
  • • Reliable thermal cycling without cooling degradation

Supported DUT packages

  • • BGA, FCBGA, LGA, QFN, QFP, CSP, WLCSP
  • • IC, CPU, GPU, DPU
  • • Bare Die and other Devices Under Test

Diverse applications

  • Suitable for Automotive in-vehicle brake cylinder and ECU testing, semiconductor device characterization, optical transceiver characterization and production tuning, RF amplifier, connector and oscillator thermal testing, network device design and validation thermal testing, telecom and datacom component thermal conditioning, power electronics temperature testing, sensor and PCB thermal shock and life cycle testing

Product comparison

Model Type Temperature Range Temperature Stability Power Range Special Features Supported DUT Types
Mug-SH High Power Direct Contact -75°C to 150°C ±0.1°C 0-1500 W 20-180 Kg Force on DUT/Socket (Optional up to 300 Kg) IC, CPU, GPU, DPU
Mug-PLATE Cold/Hot Plate -75°C to 200°C ±0.1°C - No need for L-N2, L-CO2, TEC, or Liquid General Purpose Testing
Mid Medium Power Direct Contact -60°C to 150°C ±0.1°C 0-250 W 3-75 Kg Force on DUT/Socket BGA, FCBGA, LGA, QFN, QFP, CSP, WLCSP
Fix Low Power Direct Contact -55°C to 150°C ±0.1°C 0-100 W 3-75 Kg Force on DUT/Socket BGA, FCBGA, LGA, QFN, QFP, CSP, WLCSP

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Mug-SH

High-Powered IC Device Testing (0-800 W)

  • Temperature Range: -75°C to 150°C (±0.1°C)
  • Ideal for extreme temperature testing of high-powered IC devices
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Mug-PLATE

Innovative Cold Plate Technology

  • Temperature Range: -75°C to 200°C (±0.1°C)
  • Advanced solution without need for CO2 or N2
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Fix

Low-Powered IC Device Testing (0-100 W)

  • Temperature Range: -55°C to 150°C (±0.1°C)
  • Benchtop solution for low-powered IC devices
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EXCEL-10

Medium-Powered IC Device Testing (0-350 W)

  • Temperature Range: -70°C to 200°C (±0.1°C)
  • Benchtop solution for medium-powered IC devices
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EXCEL-12

High-Powered IC Device Testing (0-1200 W)

  • Temperature Range: -20°C to 150°C (±0.1°C)
  • Solution for High-Powered IC devices
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EXCEL-15

High-Powered IC Device Testing up to 1500 W

  • Temperature Range: -75°C to 150°C (±0.1°C)
  • Ideal for High-Powered IC devices
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