Mug-PLATE

Innovative Cold Plate

Advanced Cold/Hot Plate with wide temperature range for diverse testing applications, without the need for CO2 or N2

The Mug-PLATE is an innovative cold plate solution designed for a wide range of testing applications. With its advanced temperature control capabilities and unique design, it offers a versatile and convenient platform for various industries requiring precise temperature cycling.

Key Features

Performance Features

Advanced design

Convenient operation

Diverse applications

Product comparison

Model Type Temperature Range Temperature Stability Power Range Special Features Supported DUT Types
Mug-SH High Power Direct Contact -75°C to 150°C ±0.1°C 0-1500 W 20-180 Kg Force on DUT/Socket (Optional up to 300 Kg) IC, CPU, GPU, DPU
Mug-PLATE Cold/Hot Plate -75°C to 200°C ±0.1°C - No need for L-N2, L-CO2, TEC, or Liquid General Purpose Testing
Mid Medium Power Direct Contact -60°C to 150°C ±0.1°C 0-250 W 3-75 Kg Force on DUT/Socket BGA, FCBGA, LGA, QFN, QFP, CSP, WLCSP
Fix Low Power Direct Contact -55°C to 150°C ±0.1°C 0-100 W 3-75 Kg Force on DUT/Socket BGA, FCBGA, LGA, QFN, QFP, CSP, WLCSP

Explore other eldrotec products

Mug-SH

High-Powered IC Device Testing (0-1500 W)

  • Temperature Range: -75°C to 150°C (±0.1°C)
  • Ideal for extreme temperature testing of high-powered IC devices

Mug-PLATE

Innovative Cold Plate Technology

  • Temperature Range: -75°C to 200°C (±0.1°C)
  • Advanced solution without need for CO2 or N2

Mid

Medium-Powered IC Device Testing (0-250 W)

  • Temperature Range: -60°C to 150°C (±0.1°C)
  • Benchtop solution for medium-powered IC devices

Fix

Low-Powered IC Device Testing (0-100 W)

  • Temperature Range: -55°C to 150°C (±0.1°C)
  • Benchtop solution for low-powered IC devices

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Discover how the Mug-PLATE can benefit your operations. Contact our team for detailed specifications and personalized consultation.
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