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Fix

Direct Contact Temperature Forcing System

Benchtop temperature forcing system for testing low-powered IC devices in extreme temperatures, with power range 0-100 W and precise temperature control

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The Fix is a compact benchtop temperature forcing system designed for testing low-powered IC devices across a wide temperature range. With its highly responsive and thermally conductive path, it quickly induces precise temperatures to the Device Under Test (DUT), offering reliable performance for various testing applications.

Key Features

Performance Features

  • • Temperature range: -55°C to 150°C
  • • Temperature stability: ±0.1°C
  • • Power range: 0-100 W
  • • T-CASE: -40°C at 25W

Advanced design

  • • Fully automated DUT pressure force: ~3-75 Kg Force on DUT/Socket ±1 Kg
  • • Patented thermal probe
  • • Robust refrigeration technology without thermoelectric modules
  • • Reliable thermal cycling without cooling degradation

Supported DUT packages

  • • BGA, FCBGA, LGA, QFN, QFP, CSP, WLCSP
  • • IC, CPU, GPU, DPU
  • • Bare Die and other Devices Under Test

Diverse applications

  • Suitable for Automotive in-vehicle brake cylinder and ECU testing, semiconductor device characterization, optical transceiver characterization and production tuning, RF amplifier, connector and oscillator thermal testing, network device design and validation thermal testing, telecom and datacom component thermal conditioning, power electronics temperature testing, sensor and PCB thermal shock and life cycle testing

Product comparison

Model Type Temperature Range Temperature Stability Power Range Special Features Supported DUT Types
Mug-SH High Power Direct Contact -75°C to 150°C ±0.1°C 0-1500 W 20-180 Kg Force on DUT/Socket (Optional up to 300 Kg) IC, CPU, GPU, DPU
Mug-PLATE Cold/Hot Plate -75°C to 200°C ±0.1°C - No need for L-N2, L-CO2, TEC, or Liquid General Purpose Testing
Mid Medium Power Direct Contact -60°C to 150°C ±0.1°C 0-250 W 3-75 Kg Force on DUT/Socket BGA, FCBGA, LGA, QFN, QFP, CSP, WLCSP
Fix Low Power Direct Contact -55°C to 150°C ±0.1°C 0-100 W 3-75 Kg Force on DUT/Socket BGA, FCBGA, LGA, QFN, QFP, CSP, WLCSP

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Mug-SH

High-Powered IC Device Testing (0-1500 W)

  • Temperature Range: -75°C to 150°C (±0.1°C)
  • Ideal for extreme temperature testing of high-powered IC devices
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Mug-PLATE

Innovative Cold Plate Technology

  • Temperature Range: -75°C to 200°C (±0.1°C)
  • Advanced solution without need for CO2 or N2
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Mid

Medium-Powered IC Device Testing (0-250 W)

  • Temperature Range: -60°C to 150°C (±0.1°C)
  • Benchtop solution for medium-powered IC devices
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Fix

Low-Powered IC Device Testing (0-100 W)

  • Temperature Range: -55°C to 150°C (±0.1°C)
  • Benchtop solution for low-powered IC devices
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